Semi-insulating GaN on Sapphire or Silicon Template

Semi-insulating GaN on Sapphire or Silicon Template

Ganwafer’s Template Products includes  4” and 2” Semi-Insulating GaN on Sapphire/Silicon Substrates, which are epi-ready.

Description

1. Specifications of Semi-Insulating GaN on Sapphire Template

1.1  4 inch Semi-Insulating GaN/Sapphire Substrates

tem GANW-T-GaN-100-SI
Dimension 100 ±0.1 mm
Thickness 1.8 ±0.5 μm
Orientation of GaN C plane (0001) off angle toward A-axis 0.2 ±0.1°
Orientation Flat of GaN (1-100) 0 ±0.2°, 16 ±1 mm
Conduction Type Semi-Insulating
Resistivity (300K) > 105 Ω·cm
Carrier Concentration >1x1018cm-3(≈doping concentration)
Mobility ~ 200cm2 / V·s
Dislocation Density < 5x108cm-2(estimated by FWHMs of XRD)
Structure 1.8 μm GaN/~ 50 nm uGaN buffer layer/430 ±25 μm sapphire
Orientation of Sapphire C plane (0001) off angle toward M-axis 0.2 ±0.1°
Orientation Flat of Sapphire (11-20) 0 ±0.2°, 16 ±1 mm
Surface Roughness: Front side: Ra<0.5nm, epi-ready;
Back side: etched or polished.
Useable Area > 90% (edge and macro defects exclusion)
Package each in single wafer container, under nitrogen atmosphere, packed in class 100 clean room

 

1.2  2 inch Semi-insulating GaN/Sapphire Substrates

Item GANW-T-GaN-50-SI
Dimension 50.8 ±0.1 mm
Thickness 1.8 ±0.5 μm
Orientation of GaN C plane (0001) off angle toward A-axis 0.2 ±0.1°
Orientation Flat of GaN (1-100) 0 ±0.2°, 16 ±1 mm
Conduction Type Semi-Insulating
Resistivity (300K) > 105 Ω·cm
Carrier Concentration >1x1018cm-3(≈doping concentration)
Mobility ~ 200cm2 / V·s
Dislocation Density < 5x108cm-2(estimated by FWHMs of XRD)
Structure 1.8 μm GaN/~ 50 nm uGaN buffer layer/430 ±25 μm sapphire
Orientation of Sapphire C plane (0001) off angle toward M-axis 0.2 ±0.1°
Orientation Flat of Sapphire (11-20) 0 ±0.2°, 16 ±1 mm
Surface Roughness: Front side: Ra<0.5nm, epi-ready;
Back side: etched or polished.
Useable Area > 90% (edge and macro defects exclusion)
Package each in single wafer container, under nitrogen atmosphere, packed in class 100 clean room

 

2. List of Semi-insulating GaN on Silicon Template

Description  Type Dopant Substrate Size GaN thickness Surface
GaN Template on 4″ Silicon Wafer, GaN film semi-insulating Si (111) substrates 4″ 2um single side polished
GaN Template on 2″ Silicon Wafer, GaN film semi-insulating Si (111) substrates 2″ 2um single side polished

 

Remark:
The Chinese government has announced new limits on the exportation of Gallium materials (such as GaAs, GaN, Ga2O3, GaP, InGaAs, and GaSb) and Germanium materials used to make semiconductor chips. From August 1, 2023 on, exporting these materials is only allowed if we obtains a license from the Chinese Ministry of Commerce. Hope for your understanding!

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