GaN pada Silicon HEMT Wafer

GaN pada Silicon HEMT Wafer

Ganwafer offers GaN (Gallium Nitride) on Silicon (Si) Epitaxy HEMT wafer and GaN template on Si substrate. According to different applications, GaN on Silicon HEMT wafer can be classified into GaN-on-Silicon wafer for D-mode, GaN on Silicon substrate for E-mode and GaN on Silicon wafer for RF application. GaN based power electronic devices are still very expensive compared with Si devices. One of the ways to solve the cost problem is to fabricate GaN based heterostructures by epitaxy on Si substrate, and then to fabricate GaN based devices by complementary metal oxide semiconductor (CMOS) technology, so that the cost performance of the devices is better than that of Si devices. However, it is much more difficult to grow GaN on Silicon substrates than on SiC and sapphire substrates. The lattice mismatch ratio of GaN (0001) and Silicon (111) is as high as 16.9%, and the thermal expansion coefficient mismatch (thermal mismatch) is as high as 56%. These are main epitaxial challenges of GaN on Silicon, which may be able to be solved by introducing a buffer layer to GaN on Silicon wafer substrate. As a leading GaN on Silicon HEMT wafer manufacturer, we continuously develop our existing GaN on Silicon technology to gain a better wafer to you. And now please see below GaN on Si wafer specification:

Penerangan

1. GaN pada Silicon HEMT Wafer, D-MODE

1.1 Spesifikasi Wafer GaN HEMT pada Silikon, D-MODE

Saiz wafer 2″, 4″, 6″,8″
struktur AlGaN / Gan HEMT rujuk 1.2
Ketumpatan pembawa >9E12 cm2
Mobiliti dewan /
Kerintangan Lembaran /
AFM RMS (nm) sebanyak 5x5um2 <0.25nm
Tunduk(um) <=30um
pengecualian Edge <5mm
Lapisan pasif SiN 0~5nm
Lapisan penutup u-GaN 2nm
Al komposisi 20-30%
Lapisan penghalang AlGaN /
saluran GaN /
penimbal AlGaN /
AlN /
Bahan substrat Substrat silikon
Ketebalan wafer Si (μm) 675um(2″), 1000um(4″), 1300um(6″), 1500um(8″)

 

1.2 Struktur Wafer GaN HEMT pada Silikon, D-MODE

2. GaN pada Silicon HEMT Epitaxy, E-MODE

Saiz wafer 2″, 4″, 6″,8″
struktur AlGaN / Gan HEMT rujuk 1.2
Ketumpatan 2DEG baki (Vg=0 V) <1e18/cm3
AFM RMS (nm) sebanyak 5x5um2 <0.25nm
Tunduk(um) <=30um
pengecualian Edge <5mm
p-Gan /
Lapisan penutup u-GaN /
Al komposisi 20-30%
Lapisan penghalang AlGaN /
saluran GaN /
penimbal AlGaN /
Bahan substrat Substrat silikon
Ketebalan wafer Si (μm) 675um(2″), 1000um(4″), 1300um(6″), 1500um(8″)

 

3. Wafer HEMT Gallium Nitride pada Silikon untuk Aplikasi RF

Saiz wafer 2″, 4″, 6″,8″
struktur AlGaN / Gan HEMT rujuk 1.2
Ketumpatan pembawa >9E12 cm2
Mobiliti dewan /
Kerintangan Lembaran /
AFM RMS (nm) sebanyak 5x5um2 <0.25nm
Tunduk(um) <=30um
pengecualian Edge <5mm
Lapisan pasif SiN 0~5nm
Lapisan penutup u-GaN /
Al komposisi 20-30%
Lapisan penghalang AlGaN /
saluran GaN /
penimbal AlGaN /
AlN /
Bahan substrat Substrat silikon
Kerintangan substrat Si (Ω cm) > 3000
Ketebalan wafer Si (μm) 1000um(2″), 1000um(4″), 1300um(6″), 1500um(8″)

 

Catatan:
Kerajaan China telah mengumumkan had baharu untuk pengeksportan bahan Gallium (seperti GaAs, GaN, Ga2O3, GaP, InGaAs dan GaSb) dan bahan Germanium yang digunakan untuk membuat cip semikonduktor. Mulai 1 Ogos 2023 dan seterusnya, mengeksport bahan ini hanya dibenarkan jika kami mendapat lesen daripada Kementerian Perdagangan China. Harap untuk pemahaman anda!

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