GaN na Silicon HEMT Wafer
Ganwafer offers GaN (Gallium Nitride) on Silicon (Si) Epitaxy HEMT wafer and GaN template on Si substrate. According to different applications, GaN on Silicon HEMT wafer can be classified into GaN-on-Silicon wafer for D-mode, GaN on Silicon substrate for E-mode and GaN on Silicon wafer for RF application. GaN based power electronic devices are still very expensive compared with Si devices. One of the ways to solve the cost problem is to fabricate GaN based heterostructures by epitaxy on Si substrate, and then to fabricate GaN based devices by complementary metal oxide semiconductor (CMOS) technology, so that the cost performance of the devices is better than that of Si devices. However, it is much more difficult to grow GaN on Silicon substrates than on SiC and sapphire substrates. The lattice mismatch ratio of GaN (0001) and Silicon (111) is as high as 16.9%, and the thermal expansion coefficient mismatch (thermal mismatch) is as high as 56%. These are main epitaxial challenges of GaN on Silicon, which may be able to be solved by introducing a buffer layer to GaN on Silicon wafer substrate. As a leading GaN on Silicon HEMT wafer manufacturer, we continuously develop our existing GaN on Silicon technology to gain a better wafer to you. And now please see below GaN on Si wafer specification:
- Popis
- Poptávka
Popis
1. GaN na Silicon HEMT Wafer, D-MODE
1.1 Specifikace GaN HEMT Wafer na křemíku, D-MODE
Velikost oplatky | 2″, 4″, 6″,8″ |
Struktura AlGaN/GaN HEMT | Viz 1.2 |
Hustota nosiče | >9E12 cm2 |
Halová mobilita | / |
Listový odpor | / |
AFM RMS (nm) 5x5um2 | <0,25 nm |
luk (um) | <= 30um |
Vyloučení hran | <5 mm |
SiN pasivační vrstva | 0~5nm |
krycí vrstva u-GaN | 2nm |
Al složení | 20–30 % |
AlGaN bariérová vrstva | / |
GaN kanál | / |
AlGaN buffer | / |
AlN | / |
Materiál podkladu | Silikonový substrát |
Tloušťka Si plátku (μm) | 675um (2″), 1000um (4″), 1300um (6″), 1500um (8″) |
1.2 Struktura plátku GaN HEMT na křemíku, D-MODE
2. GaN na Silicon HEMT Epitaxy, E-MODE
Velikost oplatky | 2″, 4″, 6″,8″ |
Struktura AlGaN/GaN HEMT | Viz 1.2 |
Zbytková hustota 2° (Vg=0 V) | <1e18/cm3 |
AFM RMS (nm) 5x5um2 | <0,25 nm |
luk (um) | <= 30um |
Vyloučení hran | <5 mm |
p-GaN | / |
krycí vrstva u-GaN | / |
Al složení | 20–30 % |
AlGaN bariérová vrstva | / |
GaN kanál | / |
AlGaN buffer | / |
Materiál podkladu | Silikonový substrát |
Tloušťka Si plátku (μm) | 675um (2″), 1000um (4″), 1300um (6″), 1500um (8″) |
3. Gallium nitrid HEMT Wafer na křemíku pro RF aplikaci
Velikost oplatky | 2″, 4″, 6″,8″ |
Struktura AlGaN/GaN HEMT | Viz 1.2 |
Hustota nosiče | >9E12 cm2 |
Halová mobilita | / |
Listový odpor | / |
AFM RMS (nm) 5x5um2 | <0,25 nm |
luk (um) | <= 30um |
Vyloučení hran | <5 mm |
SiN pasivační vrstva | 0~5nm |
krycí vrstva u-GaN | / |
Al složení | 20–30 % |
AlGaN bariérová vrstva | / |
GaN kanál | / |
AlGaN buffer | / |
AlN | / |
Materiál podkladu | Silikonový substrát |
Si substrátový odpor (Ω cm) | > 3000 |
Tloušťka Si plátku (μm) | 1000um (2″), 1000um (4″), 1300um (6″), 1500um (8″) |